3D Xpoint™ technology is up to 1000x faster than NAND and an individual die can store 128Gb of data.
In this video, the Radio Free HPC team looks at the newly announced 3D XPoint technology from Intel and Micron.
Following more than a decade of research and development, 3D XPoint technology was built from the ground up to address the need for non-volatile, high-performance, high-endurance and high-capacity storage and memory at an affordable cost.